Items where Author is "Cheng, Xiaojin"
Group by: Item Type | No Grouping Jump to: Conference or Workshop Item Number of items: 2. Conference or Workshop ItemBui, Thanh Tung and Cheng, Xiaojin and Watanabe, Naoya and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro (2016) A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration. In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016. Bui, Thanh Tung and Watanabe, Naoya and Cheng, Xiaojin and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system. In: International Symposium on Frontiers of Materials Science, November 2013, Hanoi, Vietnam. |
