Items where Author is "Naoya, Watanabe"
Group by: Item Type | No Grouping Number of items: 2. Bui, Thanh Tung and Naoya, Watanabe and Xiaojin, Cheng and Fumiki, Kato and Katsuya, Kikuchi and Masahiro, Aoyagi (2016) Copper-Filled Through-Silicon Vias with Parylene-HT Liner. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 6 (4). pp. 510-517. ISSN 2156-3950 Bui, Thanh Tung and Motohiro, Suzuki and Naoya, Watanabe and Katsuya, Kikuchi and Fumiki, Kato and Shunsuke, Nemoto and Aoyagi, Masahiro (2013) High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects. In: International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices, July 2013, Zweibrucken, Germany. |
