Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) TSV-IaS: Analytic analysis and low-cost non-preemptive on-line detection and correction method for TSV defects. In: 2019 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 15-17 July 2019, Florida, USA.
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Abstract
Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3DICs); however, the reliability issues due to the low yield rates and the sensitivity to thermal hotspots and stress issues are threating TSV-based 3D-ICs. On the other hand, real-time applications demand short response time to the new occurrence faults which make online testing become a critical challenge. In order to solve this problem, this paper presents an online method named TSV-IaS which supports detecting and correcting open and short defect TSVs by isolating and shifting the signals of TSVs then analyzing the output syndromes. Furthermore, we also present an analytical analysis on detectability and response time of the proposal. Results show that with R redundant TSVs in a group, the proposed method can fully correct R defects and detect R+1 defects while keeping a low-cost structure. Monte-Carlo simulations also demonstrate a 100% detection rate with 32-cycles based tests.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Electronics and Communications Electronics and Communications > Electronics and Computer Engineering |
| Divisions: | Faculty of Electronics and Telecommunications (FET) Key Laboratory for Smart Integrated Systems (SISLAB) |
| Depositing User: | Prof. Xuan-Tu Tran |
| Date Deposited: | 05 Jul 2019 04:27 |
| Last Modified: | 05 Jul 2019 04:27 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/3544 |
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