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2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. In: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 11-14 November 2019, Bangkok.

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—Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D- ICs). However, the reliability issues due to the low yield rates, the sensitivity to thermal hotspots and stress issues due to the difference in temperature between layers are preventing TSV- based 3D-ICs from being widely and efficiently used. Due to defect clustering, 3D-ICs could have multiple defects in the same region which cannot be detected by using error correction codes while dedicated testing could take a significant number of testing cycles. This paper presents a 2D Parity Product Code (2D-PPC) with the ability to correct one fault and detect, at least, two faults. With the extension using Orthogonal Latin Square, 2D- PPC could detect multiple defects while reasonably increasing the area cost and latency.

Item Type: Conference or Workshop Item (Paper)
Subjects: Electronics and Communications
Divisions: Faculty of Electronics and Telecommunications (FET)
Key Laboratory for Smart Integrated Systems (SISLAB)
Depositing User: Khanh N. Dang
Date Deposited: 04 Dec 2019 05:45
Last Modified: 04 Dec 2019 05:45

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