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Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications

Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications. In: 2013 IEEE Electronic Components and Technology Conference, 2013, Las Vegas, USA.

Full text not available from this repository.
Item Type: Conference or Workshop Item (Paper)
Subjects: Electronics and Communications
Electronics and Communications > Electronics and Computer Engineering
Divisions: Faculty of Electronics and Telecommunications (FET)
Depositing User: Ms. Cam Le Tran Thi
Date Deposited: 30 May 2016 05:44
Last Modified: 30 May 2016 05:44
URI: http://eprints.uet.vnu.edu.vn/eprints/id/eprint/839

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