Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. In: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 11-14 November 2019, Bangkok.
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Abstract
—Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D- ICs). However, the reliability issues due to the low yield rates, the sensitivity to thermal hotspots and stress issues due to the difference in temperature between layers are preventing TSV- based 3D-ICs from being widely and efficiently used. Due to defect clustering, 3D-ICs could have multiple defects in the same region which cannot be detected by using error correction codes while dedicated testing could take a significant number of testing cycles. This paper presents a 2D Parity Product Code (2D-PPC) with the ability to correct one fault and detect, at least, two faults. With the extension using Orthogonal Latin Square, 2D- PPC could detect multiple defects while reasonably increasing the area cost and latency.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Electronics and Communications |
| Divisions: | Faculty of Electronics and Telecommunications (FET) Key Laboratory for Smart Integrated Systems (SISLAB) |
| Depositing User: | Khanh N. Dang |
| Date Deposited: | 04 Dec 2019 05:45 |
| Last Modified: | 04 Dec 2019 05:45 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/3640 |
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