Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications. In: 2013 IEEE Electronic Components and Technology Conference, 2013, Las Vegas, USA.
Full text not available from this repository.
Official URL: http://dx.doi.org/10.1109/ECTC.2013.6575606
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Electronics and Communications Electronics and Communications > Electronics and Computer Engineering |
| Divisions: | Faculty of Electronics and Telecommunications (FET) |
| Depositing User: | Ms. Cam Le Tran Thi |
| Date Deposited: | 30 May 2016 05:44 |
| Last Modified: | 30 May 2016 05:44 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/839 |
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