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Items where Author is "Aoyagi, Masahiro"

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Number of items: 16.

Article

Lim, Ying Ying and Goh, Yee Mey and Yoshida, Manabu and Bui, Thanh Tung and Aoyagi, Masahiro and Liu, Changqing (2017) 30-GHz High-Frequency Application of Screen Printed Interconnects on an Organic Substrate. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (9). pp. 1506-1515.

Feng, Wei and Bui, Thanh Tung and Watanabe, Naoya and Shimamoto, Haruo and Aoyagi, Masahiro and Kikuchi, Katsuya (2016) Fabrication and stress analysis of annular-trench-isolated TSV. Microelectronics Reliability . ISSN 0026-2714 (In Press)

Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Nemoto, Shunsuke and Watanabe, Naoki and Aoyagi, Masahiro (2013) Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration. Japanese Journal of Applied Physics, 52 (4S). 04CB08. ISSN 0021-4922

Conference or Workshop Item

Tran, Thi Thuy Ha and Do, Do Quang and Dau, Van Thanh and Nguyen, Thi Kim Ngan and Le, Van Chieu and Aoyagi, Masahiro and Kikuchi, Katsuya and Bui, Thanh Tung (2017) Coplanar differential capacitively coupled contactless conductivity detection (CD-C4D) sensor for micro object inside fluidic flow recognization. In: 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

Robbins, Hannah and Liu, Changqing and Hu, Sijung and Bui, Thanh Tung and Aoyagi, Masahiro (2016) Integration of a microfluidic chip with multiplexed optical fluorescence detector through anisotropic etching of Si using Tetramethylammonium hydroxide (TMAH). In: 2016 6th Electronic System-Integration Technology Conference (ESTC).

Feng, Wei and Bui, Thanh Tung and Watanabe, Naoya and Aoyagi, Masahiro and Kikuchi, Katsuya (2016) Low Residual Stress in Si Substrate of Annular-Trench-Isolated TSV. In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Bui, Thanh Tung and Cheng, Xiaojin and Watanabe, Naoya and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro (2016) A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration. In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016.

Dang, Dinh Tiep and Bui, Thanh Tung and Vu, Quoc Tuan and Pham, Quoc Thinh and Aoyagi, Masahiro and Bui, Ngoc My and Chu, Duc Trinh (2015) Two-axis Tilt Angle Detection based on Dielectric Liquid Capacitive Sensor. In: 2015 IEEE SENSORS, 2015.

Bui, Thanh Tung and Watanabe, Naoya and Cheng, Xiaojin and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system. In: International Symposium on Frontiers of Materials Science, November 2013, Hanoi, Vietnam.

Kamei, Toshihiro and Tsujimura, Noriyuki and Sumitomo, Keiko and Laina, Ma and Bui, Thanh Tung and Aoyagi, Masahiro (2013) Towards a fully Integrated Fluorescence Detector for Point-of-Care Microfluidic Biochemical Analysis. In: International Symposium on Frontiers of Materials Science, November 2013, Hanoi, Vietnam.

Bui, Thanh Tung and Motohiro, Suzuki and Naoya, Watanabe and Katsuya, Kikuchi and Fumiki, Kato and Shunsuke, Nemoto and Aoyagi, Masahiro (2013) High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects. In: International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices, July 2013, Zweibrucken, Germany.

Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications. In: 2013 IEEE Electronic Components and Technology Conference, 2013, Las Vegas, USA.

Bui, Thanh Tung and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications. In: International Conference on Solid State Devices and Materials, 2013, Fukuoka, Japan.

Patent

US20160322282A1 (2018) Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof. US9984956B2.

US20170200644A1 (2017) Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof. US9818645B2.

National Institute Of Advanced Industrial Science And Technology (2017) Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus. US9627347 B2.

This list was generated on Mon Nov 18 20:45:45 2019 +07.