Items where Author is "Feng, Wei"
Group by: Item Type | No Grouping Number of items: 3. ArticleFeng, Wei and Bui, Thanh Tung and Watanabe, Naoya and Shimamoto, Haruo and Aoyagi, Masahiro and Kikuchi, Katsuya (2016) Fabrication and stress analysis of annular-trench-isolated TSV. Microelectronics Reliability . ISSN 0026-2714 (In Press) Conference or Workshop ItemFeng, Wei and Bui, Thanh Tung and Watanabe, Naoya and Aoyagi, Masahiro and Kikuchi, Katsuya (2016) Low Residual Stress in Si Substrate of Annular-Trench-Isolated TSV. In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). PatentUS20170200644A1 (2017) Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof. US9818645B2. |
