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Items where Author is "Fumiki, Kato"

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Bui, Thanh Tung and Naoya, Watanabe and Xiaojin, Cheng and Fumiki, Kato and Katsuya, Kikuchi and Masahiro, Aoyagi (2016) Copper-Filled Through-Silicon Vias with Parylene-HT Liner. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 6 (4). pp. 510-517. ISSN 2156-3950

Conference or Workshop Item

Bui, Thanh Tung and Motohiro, Suzuki and Naoya, Watanabe and Katsuya, Kikuchi and Fumiki, Kato and Shunsuke, Nemoto and Aoyagi, Masahiro (2013) High Accuracy, Fine Pitch Chip Stacking Based on Flip Chip Technology with Micro Bump Interconnects. In: International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices, July 2013, Zweibrucken, Germany.

Melamed, Samson and Hashino, Masaru and Fumiki, Kato and Shunsuke, Nemoto and Bui, Thanh Tung and Katsuya, Kikuchi and Hiroshi, Nakagawa (2013) Investigation of a Microchannel-based Cooling Interposer for High-Performance Memory-on-Logic 3DIC Designg. In: The 15th Electronics Packaging Technology Conference, 2013, Singapore.

This list was generated on Sun Jun 11 06:35:48 2023 +07.