Items where Author is "Kikuchi, Katsuya"

Article

Feng, Wei and Bui, Thanh Tung and Watanabe, Naoya and Shimamoto, Haruo and Aoyagi, Masahiro and Kikuchi, Katsuya (2016) Fabrication and stress analysis of annular-trench-isolated TSV. Microelectronics Reliability . ISSN 0026-2714 (In Press)

Conference or Workshop Item

Tran, Thi Thuy Ha and Do, Do Quang and Dau, Van Thanh and Nguyen, Thi Kim Ngan and Le, Van Chieu and Aoyagi, Masahiro and Kikuchi, Katsuya and Bui, Thanh Tung (2017) Coplanar differential capacitively coupled contactless conductivity detection (CD-C4D) sensor for micro object inside fluidic flow recognization. In: 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

Feng, Wei and Bui, Thanh Tung and Watanabe, Naoya and Aoyagi, Masahiro and Kikuchi, Katsuya (2016) Low Residual Stress in Si Substrate of Annular-Trench-Isolated TSV. In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Bui, Thanh Tung and Cheng, Xiaojin and Watanabe, Naoya and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro (2016) A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration. In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016.

Bui, Thanh Tung and Watanabe, Naoya and Cheng, Xiaojin and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Investigation of the applicability of parylene-HT as a dielectric layer for interconnections in 3D integration system. In: International Symposium on Frontiers of Materials Science, November 2013, Hanoi, Vietnam.

Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications. In: 2013 IEEE Electronic Components and Technology Conference, 2013, Las Vegas, USA.

Bui, Thanh Tung and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications. In: International Conference on Solid State Devices and Materials, 2013, Fukuoka, Japan.

Patent

US20160322282A1 (2018) Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof. US9984956B2.

US20170200644A1 (2017) Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof. US9818645B2.