Items where Author is "Nemoto, Shunsuke"
Group by: Item Type | No Grouping Number of items: 4. National Institute Of Advanced Industrial Science And Technology (2017) Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus. US9627347 B2. Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications. In: 2013 IEEE Electronic Components and Technology Conference, 2013, Las Vegas, USA. Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Nemoto, Shunsuke and Watanabe, Naoki and Aoyagi, Masahiro (2013) Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration. Japanese Journal of Applied Physics, 52 (4S). 04CB08. ISSN 0021-4922 Bui, Thanh Tung and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) 15-μm-pitch Cu/Au Interconnections Relied on Self-aligned Low-temperature Thermosonic Flip-chip Bonding Technique for A dvanced Chip Stacking Applications. In: International Conference on Solid State Devices and Materials, 2013, Fukuoka, Japan. |
