Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. REV Journal on Electronics and Communications .
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Abstract
Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs). However, the reliability issues due to the low yield rates and the sensitivity to thermal hotspots and stress issues are preventing TSV-based 3D-ICs from being widely and efficiently used. To enhance the reliability of TSV connections, using error correction code to detect and correct faults automatically has been demonstrated as a viable solution. This paper presents a 2D Parity Product Code (2D-PPC) for TSV fault-tolerance with the ability to correct one fault and detect, at least, two faults. In an implementation of 64-bit data and 81-bit code-word, 2D-PPC can detect over 71 faults, on average. Its encoder and decoder decrease the overall latency by 38.33\% when compared to the Single Error Correction Double Error Detection code. In addition to the high detection rates, the encoder can detect 100\% of its gate failures, and the decoder can detect and correct around 40\% of its individual gate failures. The squared 2D-PPC could be extended using orthogonal Latin square to support extra bit correction.
| Item Type: | Article |
|---|---|
| Subjects: | Electronics and Communications Electronics and Communications > Electronics and Computer Engineering Information Technology (IT) |
| Depositing User: | Khanh N. Dang |
| Date Deposited: | 31 Jan 2020 08:00 |
| Last Modified: | 03 Feb 2020 06:57 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/3927 |
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- 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. (deposited 31 Jan 2020 08:00) [Currently Displayed]
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