Dang, Nam Khanh and Ahmed, Akram Ben and Rokhani, Fakhrul Zaman and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs. In: 2020 International Conference On Advanced Technologies for Communications (ATC), 8-10 October 2020, Nha Trang.
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Official URL: http://atc-conf.org/
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Electronics and Communications ISI/Scopus indexed conference |
| Divisions: | Key Laboratory for Smart Integrated Systems (SISLAB) |
| Depositing User: | Khanh N. Dang |
| Date Deposited: | 07 Sep 2020 08:18 |
| Last Modified: | 23 Nov 2020 02:36 |
| URI: | http://eprints.uet.vnu.edu.vn/eprints/id/eprint/4048 |
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