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A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs

Dang, Nam Khanh and Ahmed, Akram Ben and Rokhani, Fakhrul Zaman and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs. In: 2020 International Conference On Advanced Technologies for Communications (ATC), 8-10 October 2020, Nha Trang.

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Official URL: http://atc-conf.org/
Item Type: Conference or Workshop Item (Paper)
Subjects: Electronics and Communications
Divisions: Key Laboratory for Smart Integrated Systems (SISLAB)
Depositing User: Khanh N. Dang
Date Deposited: 07 Sep 2020 08:18
Last Modified: 07 Sep 2020 08:18
URI: http://eprints.uet.vnu.edu.vn/eprints/id/eprint/4048

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