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Items where Author is "Meyer, Michael"

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Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) 2D Parity Product Code for TSV Online Fault Correction and Detection. REV Journal on Electronics and Communications, 10 (1-2). pp. 11-21.

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A non-blocking non-degrading multiple defects link testing method for 3D-Networks-on-Chip. IEEE Access, 8 . pp. 59571-59589. ISSN 2169-3536

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. In: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 11-14 November 2019, Bangkok.

Dang, Nam Khanh and Meyer, Michael and Okuyama, Yuichi and Abdallah, Abderazek Ben and Tran, Xuan Tu (2015) Soft-Error Resilient 3D Network-on-Chip Router. In: The IEEE 7th International Conference on Awareness Science and Technology (IEEE iCAST), 22-24 September 2015, Qinhuangdao, China.

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