Items where Author is "Ahmed, Akram Ben"

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2021) HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems . ISSN 0278-0070 (In Press)

Dang, Nam Khanh and Ahmed, Akram Ben and Rokhani, Fakhrul Zaman and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs. In: 2020 International Conference On Advanced Technologies for Communications (ATC), 8-10 October 2020, Nha Trang.

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems. IEEE Access, 8 . pp. 166642-166657. ISSN 2169-3536

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) Thermal distribution and reliability prediction for 3D Networks-on-Chip. VNU Journal of Computer Science and Communication Engineering, 36 (1). pp. 65-77. ISSN 0866-8612

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) 2D Parity Product Code for TSV Online Fault Correction and Detection. REV Journal on Electronics and Communications, 10 (1-2). pp. 11-21.

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 28 (3). pp. 672-685. ISSN 1063-8210

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A non-blocking non-degrading multiple defects link testing method for 3D-Networks-on-Chip. IEEE Access, 8 . pp. 59571-59589. ISSN 2169-3536

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. In: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 11-14 November 2019, Bangkok.

Dang, Nam Khanh and Ahmed, Akram Ben and Tran, Xuan Tu (2019) An on-communication multiple-TSV defects detection and localization for real-time 3D-ICs. In: 2019 IEEE 13th International Symposium on embedded Multicore/Manycore Systems-on-Chip (IEEE MCSoC-2019), 1-3 October 2019, Singapore. (In Press)

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) TSV-IaS: Analytic analysis and low-cost non-preemptive on-line detection and correction method for TSV defects. In: 2019 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 15-17 July 2019, Florida, USA.

Dang, Nam Khanh and Ahmed, Akram Ben and Okuyama, Yuichi and Abdallah, Abderazek Ben (2017) Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems. IEEE Transactions on Emerging Topics in Computing . ISSN 2168-6750

Dang, Nam Khanh and Ahmed, Akram Ben and Tran, Xuan Tu and Okuyama, Yuichi and Abdallah, Abderazek Ben (2017) A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 25 (11). pp. 3099-3112. ISSN 1063-8210