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Items where Author is "Abdallah, Abderazek Ben"

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Number of items: 17.

Article

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) Thermal distribution and reliability prediction for 3D Networks-on-Chip. VNU Journal of Computer Science and Communication Engineering, 36 (1). pp. 65-77. ISSN 0866-8612

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) 2D Parity Product Code for TSV Online Fault Correction and Detection. REV Journal on Electronics and Communications, 10 (1-2). pp. 11-21.

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 28 (3). pp. 672-685. ISSN 1063-8210

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A non-blocking non-degrading multiple defects link testing method for 3D-Networks-on-Chip. IEEE Access, 8 . pp. 59571-59589. ISSN 2169-3536

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems. IEEE Access . (In Press)

Dang, Nam Khanh and Ahmed, Akram Ben and Okuyama, Yuichi and Abdallah, Abderazek Ben (2017) Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems. IEEE Transactions on Emerging Topics in Computing . ISSN 2168-6750

Dang, Nam Khanh and Ahmed, Akram Ben and Tran, Xuan Tu and Okuyama, Yuichi and Abdallah, Abderazek Ben (2017) A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 25 (11). pp. 3099-3112. ISSN 1063-8210

Book Section

Dang, Nam Khanh and Abdallah, Abderazek Ben (2018) Architecture and Design Methodology for Highly-Reliable TSV-NoC Systems. In: Horizons in Computer Science Research. Nova Science Publishers, pp. 199-246. ISBN 978-1-53613-327-1

Conference or Workshop Item

Dang, Nam Khanh and Ahmed, Akram Ben and Rokhani, Fakhrul Zaman and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs. In: 2020 International Conference On Advanced Technologies for Communications (ATC), 8-10 October 2020, Nha Trang.

Ikechukwu, Ogbodo Mark and Vu, The H. and Dang, Nam Khanh and Abdallah, Abderazek Ben (2020) Light-weight Spiking Neuron Processing Core for Large-scale 3D-NoC based Spiking Neural Network Processing Systems. In: The 7th IEEE International Conference on Big Data and Smart Computing, Jeju, Korea. (In Press)

Ogbodo, Mark and Dang, Nam Khanh and Tomohide, Fukuchi and Abdallah, Abderazek Ben (2020) Architecture and Design of a Spiking Neuron Processor Core Towards the Design of a Large-scale Event-Driven 3D-NoC-based Neuromorphic Processor. In: The 2nd ACM Chapter International Conference on Educational Technology, Language and Technical Communication (ETLTC2020).

Dang, Nam Khanh and Abdallah, Abderazek Ben (2019) An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems. In: The International Conference on Internet of Things, Embedded Systems and Communications (IINTEC 2019). (In Press)

Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. In: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 11-14 November 2019, Bangkok.

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) TSV-IaS: Analytic analysis and low-cost non-preemptive on-line detection and correction method for TSV defects. In: 2019 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 15-17 July 2019, Florida, USA.

Abdallah, Abderazek Ben and Dang, Nam Khanh and Okuyama, Yuichi (2017) A Low-overhead Fault tolerant Technique for TSV-based Interconnects in 3D-IC Systems. In: Sciences and Techniques of Automatic Control and Computer Engineering (STA), 2017 18th International Conference on, 21-23 December 2017, Monastir, Tunisia.

Dang, Nam Khanh and Meyer, Michael and Okuyama, Yuichi and Abdallah, Abderazek Ben and Tran, Xuan Tu (2015) Soft-Error Resilient 3D Network-on-Chip Router. In: The IEEE 7th International Conference on Awareness Science and Technology (IEEE iCAST), 22-24 September 2015, Qinhuangdao, China.

Patent

Univ of Aizu, Aizu Laboratory Inc (2019) 3dネットワークオンチップのためのtsv誤り耐容ルータ装置 TSV Error Tolerant Router Device for 3D Network On Chip. JP2019092020A.

This list was generated on Mon Oct 26 06:14:05 2020 +07.