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Items where Author is "Abdallah, Abderazek Ben"

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Number of items: 6.

Article

Dang, Nam Khanh and Ahmed, Akram Ben and Okuyama, Yuichi and Abdallah, Abderazek Ben (2017) Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems. IEEE Transactions on Emerging Topics in Computing . ISSN 2168-6750 (In Press)

Dang, Nam Khanh and Ahmed, Akram Ben and Tran, Xuan Tu and Okuyama, Yuichi and Abdallah, Abderazek Ben (2017) A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 25 (11). pp. 3099-3112. ISSN 1063-8210

Book Section

Dang, Nam Khanh and Abdallah, Abderazek Ben (2018) Architecture and Design Methodology for Highly-Reliable TSV-NoC Systems. In: Horizons in Computer Science Research. Nova Science Publishers, pp. 199-246. ISBN 978-1-53613-327-1

Conference or Workshop Item

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) TSV-IaS: Analytic analysis and low-cost non-preemptive on-line detection and correction method for TSV defects. In: 2019 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 15-17 July 2019, Florida, USA.

Abdallah, Abderazek Ben and Dang, Nam Khanh and Okuyama, Yuichi (2017) A Low-overhead Fault tolerant Technique for TSV-based Interconnects in 3D-IC Systems. In: Sciences and Techniques of Automatic Control and Computer Engineering (STA), 2017 18th International Conference on, 21-23 December 2017, Monastir, Tunisia.

Dang, Nam Khanh and Meyer, Michael and Okuyama, Yuichi and Abdallah, Abderazek Ben and Tran, Xuan Tu (2015) Soft-Error Resilient 3D Network-on-Chip Router. In: The IEEE 7th International Conference on Awareness Science and Technology (IEEE iCAST), 22-24 September 2015, Qinhuangdao, China.

This list was generated on Tue Nov 19 16:44:02 2019 +07.